3

Edge Computing: Vision and Challenges

Année:
2016
Langue:
english
Fichier:
PDF, 788 KB
english, 2016
8

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones

Année:
2012
Langue:
english
Fichier:
PDF, 423 KB
english, 2012
13

Mixed mode fracture criteria for an interface crack

Année:
1994
Langue:
english
Fichier:
PDF, 744 KB
english, 1994
23

Stacked solder bumping technology for improved solder joint reliability

Année:
2001
Langue:
english
Fichier:
PDF, 1013 KB
english, 2001
34

LED diffused transmission freeform surface design for uniform illumination

Année:
2019
Langue:
english
Fichier:
PDF, 1.19 MB
english, 2019
40

Effect of substrate flexibility on solder joint reliability

Année:
2002
Langue:
english
Fichier:
PDF, 543 KB
english, 2002
48

Design and cold flow test of a scramjet nozzle with nonuniform inflow

Année:
2015
Langue:
english
Fichier:
PDF, 2.54 MB
english, 2015